Thin Film Process Development Engineer (Writer) Job at ...

OverviewThin Film Process Development Engineer (Writer). Location: Milpitas, CA. Salary range: $120,819.00 - $177,675.00 per year + bonus target + benefits. This position reports to the Director, Thin Film Process Development Engineering.Under the direction of the Director of Thin Film Process Development Engineering, the Thin Film Process Development Engineer is responsible for developing, monitoring, sustaining, and supporting advanced writer film, PMR, TAMR or other sensor processes for new and prototype products; designing and conducting advanced wafer experiments, analyzing the data, and reporting the results; developing and implementing new practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; developing and implementing procedures for transitioning new products into the production line; and reviewing, updating, and maintaining documentation and process instructions.ResponsibilitiesDevelops, sustains, and supports advanced thin film processes for new and prototype products; develops and implements novel approaches to improve and optimize PMR, TAMR and advanced writer processesDevelops and implements practices or methodologies which reduce cost and improve operational efficiencyConducts root cause analysis and implements corrective action if requiredDevelops and implements processes or procedures for transitioning new products into the production lineResolves process issues related to material selection; recommends corrective actionReviews, updates, and maintains documentation and process instructionsInstructs operators and technicians on processes and procedures, including modifications to existing proceduresPartners with equipment and maintenance personnel to minimize tool downtime and integrate new tools into the production lineDesigns and conducts advanced experiments, analyzes data, and develops recommendations for improving performance or reducing cost based on test resultsCollaborates with process and product engineering and other groups to develop and implement new processes which reduce scrap and improve yieldResponds to inquiries from team members, managers, or departmentsAdheres to all safety policies and proceduresPerforms other duties of a similar nature or level as requiredQualificationsMaster’s degree in Electrical Engineering, Materials Science, or Physics, and/or equivalent relevant experience; PhD preferredThree years of hands-on experience in PVD/IBD/CVD/ALD/PECVD technologyStrong industry experience in the magnetic recording head, hard disk drive, or semiconductor industry in a thin film process development engineering roleStrong knowledge and experience using JMP, SPC, or similar softwareProficient in the use of Microsoft Office ApplicationsKnowledge, Skills, and AbilitiesStrong knowledge and experience of PVD, IBD, CVD, ALD, PECVD processes in PMR, TAMR, and other writer areasStrong knowledge of thin film manufacturing processes, practices, and techniquesStrong knowledge of wafer fabrication processing techniques and tools such as PVD, IBD, CVD, ALD, and PECVDAbility to use Microsoft Office to create spreadsheets, documents, and presentationsAbility to design experiments, analyze results, and recommend corrective action to reduce scrap and improve yieldStrong critical thinking to resolve issues, perform root cause analysis, and propose process improvementsEffective communication skills, both verbal and written, with all levels of staff and managementAbility to work collaboratively across levels of employees and managementCommitment to safety policies and proceduresStrong organizational and time management skillsProblem-solving and troubleshooting skillsFlexibility and ability to prioritizeWorking ConditionsWorks primarily in an office environment; schedule may vary to meet business needs. May travel between sites. May work in a class 100 ESD-sensitive wafer fab environment and wear appropriate safety attire. May be exposed to hazardous chemicals, fumes, or vapors and loud noises in the wafer manufacturing facility. Occasional lifting of 20 pounds or more.DDK/Headway Technologies, Inc. is an equal employment opportunity employer. Applications from all qualified individuals are welcome without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation should contact the Headway Human Resources Department.NoteReferrals increase your chances of interviewing at Headway Technologies. #J-18808-Ljbffr

Created: 2025-11-13