Electro Mechanical Engineer

Key ResponsibilitiesDesign 300 mm wafer chucks including vacuum chucks, edge-grip mechanisms, compliant fingers, and kinematic supports.Perform stress, deformation, and warp accommodation modeling to ensure ultra-low wafer stress during handling.Develop motion mechanisms for raise/lower (Z-axis) and edge-grip actuation that prevent wafer damage and meet precision requirements.Ensure all designs meet ISO Class 1 cleanroom particle generation specifications and support high-volume, 24/7 fab operation.Select appropriate low-outgassing, non-particulating materials (e.g., PEEK, Vespel, Alumina, DLC, etc.) and coatings suitable for semiconductor tools.Work with controls engineers on soft-landing, jerk-limited motion profiles, and closed-loop sensing for wafer presence, alignment, and force control.Conduct FEA simulations for thin-wafer stress, contact mechanics, modal behavior, and static/dynamic loads.Perform particle testing, vacuum leak testing, wafer stress validation, and endurance testing.Generate engineering documentation: DFMEA, test plans, tolerance stackups, and SEMI/ISO compliance documents.Collaborate with cross-functional teams (systems, electronics, materials, manufacturing) for prototype builds and tool integration.Skill RequirementsTechnical Skills300 mm wafer handling design (edge-grip, vacuum, kinematic support)Precision chuck design & compliant mechanismsFEA (ANSYS, Abaqus, COMSOL) - stress, modal, and contact analysisModeling warped/bowed wafers, thin-plate mechanicsCleanroom design principles - ISO Class 1, low-particle mechanismsVacuum system design, leak-tight sealing, He-leak testingMaterial selection for semiconductor tools:PEEK, Vespel, PTFE, PPSAlumina, Aluminum Nitride, Ti-6Al-4VHard anodize, DLC, TiN, Parylene coatingsMotion system design:Linear motors, voice-coil actuators, pneumatic micro-actuatorsFlexures, guides, cross-roller bearingsJerk-limited (S-curve) motion and soft-landing controlEdge-grip mechanism design with low clamping forcesTolerance analysis, GD&T, DFMEA, DOESemiconductor standards familiarity: SEMI M1, M49, E57, E84, ISO 14644Metrology & Testing SkillsWarp, bow, TTV measurement techniquesParticle measurement and contamination controlVacuum integrity tests (helium mass spectrometer, pressure decay)Wafer alignment and edge detection sensors (optical/capacitive)Reliability testing for 24/7 fab dutySoftware SkillsCAD: SolidWorks, Creo, NXSimulation tools: ANSYS/Abaqus/COMSOLData tools: MATLAB, PythonMotion/controls: Beckhoff TwinCAT, Siemens/Omron PLCsSoft SkillsStrong cross-functional collaborationRoot cause analysis (8D, 5-Whys, Ishikawa)Clear documentation & communicationOwnership and design-for-reliability mindset

Created: 2026-05-15