Design Support and Manufacturing Documentation Process ...

US CITIZENSHIP REQUIRED FOR THIS POSITION: YesRELOCATION ASSISTANCE: Relocation assistance may be availableCLEARANCE TYPE: SecretTRAVEL: Yes, 10% of the TimeDescriptionJoin Northrop Grumman on our continued mission to push the boundaries of possible across land, sea, air, space, and cyberspace. Enjoy a culture where your voice is valued and start contributing to our team of passionate professionals providing real-life solutions to our world''s biggest challenges. We take pride in creating purposeful work and allowing our employees to grow and achieve their goals every day by Defining Possible. With our competitive pay and comprehensive benefits, we have the right opportunities to fit your life and launch your career today.Northrop Grumman Mission Systems is seeking a talented and motived Microelectronics Back End of Line (BEOL) Design Support and Manufacturing Documentation Process Engineer for our Advanced Packaging Technology µ-Line - located in Apopka, Florida.Northrop Grumman''s semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development.The Apopka Florida wafer bumping µ-Line, will support flip chip, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs. The line will provide a range of bump compositions, including tin/lead, lead-free, microbumps, and copper pillar. Techniques will include sputter, electro plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging. The devices supported in Apopka will also be subjected to singulation and die/wafer probe testing.The Design Support and Manufacturing Documentation Process Engineer will play a key role in our new product standup and production manufacturing processes. This individual will support the Photolithography and solder-sphere transfer tooling design process for a variety of technologies. Also integral to the role will be the support and creation of underpinning manufacturing documentation to drive our sector''s Enterprise Resource Planning and Material Requirements Planning systems.Roles and Responsibilities:The areas of focus will be the Photolithography, copper pillar, and solder-sphere transfer tooling design processes. This responsibility encompasses being the manufacturing interface and SME with the mask design group and program Staff Engineers to assure layouts meet all design rules and guidelines.The selected candidate will have responsibility forGathering GDS files and foundry data from various programs Independently be able to complete a kickoff for each program with mask group Support mask group to assure layouts are completed correctly and on schedule Translate foundry GDS data to solder-sphere transfer tooling Process Engineer and support tool manufacturing process and scheduleThis is a full-time 1st shift position. Join us for the chance to work with an amazing, experienced, and talented team. We are expanding with new work on many development and production programs.Required Skills* Experience with using and interpreting GDS files* Ability and understanding of how to properly follow design guidelines and rules to generate DRC compliant designs* Understand how mask designs support photolithography aligner/exposure tools* Familiarity with BEOL wafer Photo Lithography process* Experience leading/supporting design review processPreferred Skills* Wafer bump process development and optimization* BEOL wafer Photo Lithography process development and optimization.* Lean Manufacturing* Statistical Process Control* Continuous Improvement techniques* Experience with SAP MRP/ERP SystemsBasic Qualifications Design Support and Manufacturing Documentation Process Engineer:Bachelor''s Degree in Engineering, Microelectronics, Material Science, Physics or closely related technical major with 2 years of relevant experienceMust be familiar in backend processingBasic understanding of semiconductor devicesCandidate must possess good interpersonal and communication skills, both written and verbal, problems solving skills with ability to work with a diverse group of people including technicians, engineers, and management.Ability to obtain and maintain a Secret clearance (US citizenship required):Bachelor''s Degree in Engineering, Microelectronics, Material Science, Physics or closely related technical major with 2 years of relevant experienceMust be familiar in backend processingBasic understanding of semiconductor devicesCandidate must possess good interpersonal and communication skills, both written and verbal, problems solving skills with ability to work with a diverse group of people including technicians, engineers, and management.Ability to obtain and maintain a Secret clearance (US citizenship required)Basic Qualifications Principal Design Support and Manufacturing Documentation Process Engineer:Bachelor''s Degree in Engineering, Microelectronics, Material Science, Physics or closely related technical major with 5 years of relevant experienceMust be familiar in backend processingBasic understanding of semiconductor devicesCandidate must possess good interpersonal and communication skills, both written and verbal, problems solving skills with ability to work with a diverse group of people including technicians, engineers, and management.Ability to obtain and maintain a Secret clearance (US citizenship required)Preferred Qualifications:Bachelor''s Degree in Engineering, Microelectronics, Material Science, Physics or closely related technical major with 5 years of relevant experienceExperience in lean manufacturing practices and structured problem-solving methodologyExperience developing technical specifications for process tooling material procurementActive Secret clearanceMANUMSSalary Range: $78,600.00 - $118,000.00Salary Range 2: $87,600.00 - $131,400.00Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The health and safety of our employees and their families is a top priority. The company encourages employees to remain up-to-date on their COVID-19 vaccinations. U.S. Northrop Grumman employees may be required, in the future, to be vaccinated or have an approved disability/medical or religious accommodation, pursuant to future court decisions and/or government action on the currently stayed federal contractor vaccine mandate under Executive Order 14042 Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit U.S. Citizenship is required for most positions.

Created: 2025-11-15