Architect / Technical Lead - System / Packaging / ...

Architect / Technical Lead - System / Packaging / ThermalArchitect / Technical Lead - System / Packaging / ThermalGet AI-powered advice on this job and more exclusive features.The era of pervasive AI has arrived. In this era, organizations will use generative AI to unlock hidden value in their data, accelerate processes, reduce costs, drive efficiency and innovation to fundamentally transform their businesses and operations at scale.SambaNova Suite is the first full-stack, generative AI platform, from chip to model, optimized for enterprise and government organizations. Powered by the intelligent SN40L chip, the SambaNova Suite is a fully integrated platform, delivered on-premises or in the cloud, combined with state-of-the-art open-source models that can be easily and securely fine-tuned using customer data for greater accuracy. Once adapted with customer data, customers retain model ownership in perpetuity, so they can turn generative AI into one of their most valuable assets.Working at SambaNovaSambaNova Systems is seeking an experienced and passionate System / Packaging / Thermal Engineering Lead / Architect to drive the most advanced system/packaging technology from conception to production.ResponsibilitiesPathfinding - establish relationship with foundry, OSAT, material supplier to develop package development roadmap; plan test vehicle when necessaryProduct definition - drive physical architecture through collaboration with system architect for future productProduct development - manage design process, review thermal, mechanical analysis result, final product sign off.New product introduction: manage DOEs for initial build and product quality; drive triage effort with partners for any unexpected quality and reliability issue.Basic Required Skills/Qualifications:MS in Mechanical Engineering, Materials Science, or a similar field15+ experience years in thermal design or related fieldAdditional Required Skills/QualificationsExtensive experience in leading thermal architecture design, modeling, development and testing for custom silicon chips and system solutions (including liquid-cooling, air-cooling ) for enterprise systems.Knowledge of advanced packaging manufacturing flows and processesExperience with successful package product qualification with large complex package designAnnual Salary Range and LevelThe base salary for this position ranges from $200,000/year up to $235,000/year. This range is based on role, level, and location and reflects the salary target for new hires in the US. Individual pay within the range will depend on a number of factors, including a candidate’s job-related qualifications, skills, competencies and experience, and location.Submission GuidelinesPlease note that in order to be considered an applicant for any position at SambaNova Systems, you must submit an application form for each position for which you believe you are qualified.EEO PolicySambaNova Systems is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard basis of age (40 and over), color, disability, gender identity, genetic information, marital status, military or veteran status, national origin/ancestry, race, religion, creed, sex (including pregnancy, childbirth, breastfeeding), sexual orientation, and any other applicable status protected by federal, state, or local laws.Benefits Summary For US-Based, Full-Time Employment PositionsSambaNova offers a competitive total rewards package, including the base salary, plus equity and benefits. We cover 95% premium coverage for employee medical insurance, and 77% premium coverage for dependents and offer a Health Savings Account (HSA) with employer contribution. We also offer Dental, Vision, Short/Long term Disability, Basic Life, Voluntary Life, and AD&D insurance plans in addition to Flexible Spending Account (FSA) options like Health Care, Limited Purpose, and Dependent Care. Our library of well-being benefits available to you and your dependents includes a full subscription to Headspace, Gympass+ membership with access to physical gyms, One Medical membership, counseling services with an Employee Assistance Program, and much more.Seniority levelSeniority levelMid-Senior levelEmployment typeEmployment typeFull-timeJob functionJob functionEngineering and Information TechnologyIndustriesComputer Hardware ManufacturingReferrals increase your chances of interviewing at SambaNova by 2xGet notified about new Lead Technical Architect jobs in Palo Alto, CA.Palo Alto, CA $200,000.00-$250,000.00 3 weeks agoPalo Alto, CA $210,000.00-$260,000.00 3 weeks agoSan Jose, CA $135,910.00-$223,285.00 6 hours agoMountain View, CA $119,800.00-$258,000.00 5 days agoSan Francisco Bay Area $160,000.00-$190,000.00 2 weeks agoSr. Software Engineer, Full-Stack Opening, USA[Future Opportunities] Senior Software Engineer, C++San Francisco Bay Area $120,000.00-$155,000.00 1 month agoSr. Software Engineer, Full-Stack Opening, ChileSr. Software Engineer - Frontend (Remote)San Francisco Bay Area $155,000.00-$195,000.00 3 weeks agoSenior Software Engineering Technical Leader - Security PlatformSan Jose, CA $173,100.00-$241,700.00 1 week agoPleasanton, CA $100,000.00-$175,000.00 2 weeks agoMountain View, CA $165,000.00-$215,000.00 18 hours agoSan Francisco Bay Area $200,000.00-$230,000.00 3 weeks agoSenior Software Engineering Technical Leader, AI - Security PlatformSan Jose, CA $173,100.00-$241,700.00 1 week agoRedwood City, CA $165,000.00-$195,000.00 2 weeks agoSenior Software Engineer, Backend (Identity)Brisbane, CA $112,000.00-$175,000.00 2 weeks agoSenior Software Engineer, Backend (OpenLoop BNPL)Senior Software Engineer (Identity Decisioning)Senior Software Engineer, Backend (Identity)Pleasanton, CA $100,000.00-$175,000.00 1 week agoSan Francisco Bay Area $200,000.00-$230,000.00 3 weeks agoSenior Software Engineer (Back End/ Full Stack)San Francisco Bay Area $165,000.00-$185,000.00 3 weeks agoSan Francisco Bay Area $120,000.00-$170,000.00 3 weeks agoWe’re unlocking community knowledge in a new way. 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Created: 2025-09-17