Principal Engineer, Packaging Engineering

OverviewSandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.ResponsibilitiesAs a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuit board assembly (PCBA) level, and host level.The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.QualificationsPh.D. in Mechanical Engineering plus >3 years, or M.S. in Mechanical Engineering plus >5 years of relevant industrial experience.Solid knowledge through academic coursework or experience in thermal modeling and measurements of IC packaging and related areas.A strong background in thermal sciences with emphasis on both analytical and measurement methods.Thorough knowledge of material thermal properties and test methods.Working knowledge in applying Computational Fluid Dynamics (CFD) in related areas; familiarity with FloTHERM and ANSYS Icepak.Working knowledge in scientific programming.Demonstrated strong work ethic and ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.SkillsStrong oral and written communication skills.Demonstrated strong work ethic.Ability to work in a global team environment and interact with other engineers to define and implement experiments and conduct relevant simulation for feasibility and validation of concepts and provide design solutions to support new package technology development.Additional InformationSandisk is committed to providing equal opportunities to all applicants and employees and will not discriminate against any applicant or employee based on protected characteristics. Our non-discrimination policy applies to all aspects of employment. We comply with applicable laws and regulations and maintain a pay transparency policy.Sandisk thrives on the power and potential of diversity. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at to advise us of your accommodation request. In your email, include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.Based on our experience, we anticipate that the application deadline will be 08/21/2025 (3 months from posting), although we reserve the right to close the application process sooner if we hire an applicant for this position before the deadline. If we are not able to hire someone from this role before the deadline, we will update this posting with a new anticipated deadline.#LI-KH1 #J-18808-Ljbffr

Created: 2025-09-17