Process Development Engineer, SiPho/Packaging/3D-HI

About Tower SemiconductorLooking for a career path in the high tech manufacturing industry? Become part of a team focused on delivering the most exciting semiconductor technology to the world! If you enjoy working with others in a fast pace environment and are looking for an opportunity to grow your career in the high tech industry then Tower Semiconductor is the place to be!Tower Semiconductor is a global specialty foundry leader! We specialize in manufacturing analog integrated circuits for more than 300 customers worldwide in growing markets such as automotive, medical, industrial, consumer and aerospace and defense, among others.Job DescriptionResponsible for process development of specific modules and new capabilities for silicon photonics development, prototypes and initial production.Help drive technology prototypes and process release to teract with vendors, fabs, designers and customersHands-on knowledge of tools, fab processing and technology qualification, including test structure methodology, reliability and yield improvementPersonal experience in semiconductor fabrication module development, process development, packaging, and process qualificationModules will be developed for advanced packaging, 3D-HI, and for electro-optical circuits. May include customer and vendor-partner interactions as well as simulation and modelingSome travel expectedFocus is foundry -- through technology delivery and fab and customer enablementThis Job Is For You IfUnderstand & enjoy key physical principles of materials and electrical / electro-optical componentsGet excited about creating new devices and process modulesHave experience in mask & test structure requirements for R&D and product qualificationWork in a fast paced, multidisciplinary environment focused on technology deliveryHave experience in volume Semiconductor fab manufacturingEnjoy working with diverse people and solving problems as part of a team or individuallyJob RequirementsStrong understanding of semiconductor processing and integrationMinimum 5 years of experience in related semiconductor roles. MS or PhD degree in Materials, Electrical Engineering or other relevant field related to process module development, 3D-HI & packaging, Si Photonics, and Semiconductor development & manufacturingSpecific skills: .gds layout (e.g. Cadence Virtuoso software)Demonstrated knack for project management and people skills#IND100Compensation:$120,000 - $170,000 #J-18808-Ljbffr

Created: 2025-09-17