Optoelectronics Packaging Design Engineer – Powering ...

About Andiamo Andiamo is a globally recognized staffing and consulting firm specializing in placing the top 2% of technology and go-to-market professionals with the world’s largest and most well-known companies.For over 20 years, we’ve maintained the status of tier-one vendor for firms such as Amazon, Bloomberg, Palantir, MasterCard, Visa, Two Sigma, Citadel, as well as other major financial services firms, elite hedge funds, Google-backed tech start-ups, and major software firms.Our talent solutions include Permanent Placement, Contract Staffing, Executive Search, and Dedicated Recruiting Services (RPO). Find out more at Packaging Design EngineerOverviewWe are seeking a highly skilled Optoelectronics Packaging Design Engineer to take ownership of next-generation IC packaging solutions. This role requires a hands-on engineer who thrives in cross-disciplinary environments, working at the intersection of hardware, systems, manufacturing, and operations. Based in San Francisco with occasional travel, this position offers the opportunity to influence the full lifecycle of advanced optoelectronic packaging—from concept to high-volume production.Key ResponsibilitiesEnd-to-End Ownership: Lead the design, simulation, and delivery of advanced IC packaging solutions, ensuring they meet performance, reliability, and qualification requirements.Collaborative Design: Partner with electrical, optical, and mechanical engineering teams to architect high-performance assemblies for laser and optoelectronic ASIC devices used in demanding environments.Manufacturing Integration: Work closely with quality and manufacturing teams to transition designs from prototype into mass production, ensuring scalability and repeatability.Testing & Validation: Develop and execute rigorous test plans for package and system-level reliability. Conduct root cause and failure analysis to drive continuous improvement.Yield & Process Improvement: Support yield analysis and corrective actions in silicon processing and microelectronic assembly workflows.Vendor Management: Source, qualify, and manage external suppliers, overseeing DFM reviews, low-volume builds, and procurement of substrates, adhesives, optical components, PCBAs, and related tooling.Minimum Qualifications5+ years of experience in semiconductor packaging and process development, or 2+ years with a relevant master’s degree.Proficiency with 3D CAD tools (e.g., SolidWorks) and FEA simulation platforms (e.g., ANSYS).Hands-on expertise with automated high-precision die bonding, wirebonding, and optical alignment systems.Experience with multi-layer ceramic, CMOS image sensor, organic substrates, and BGA packages.Background in wafer-level processing, including thin film deposition, RIE silicon processing, wafer bonding, spin coating, and dicing/testing.Working knowledge of advanced failure analysis techniques: X-ray, SEM, 3D interferometry, microscopy, destructive testing, and cross-sectioning.Preferred QualificationsBachelor’s or Master’s degree in Materials Science, Electrical Engineering, Mechanical Engineering, or related field.Experience with optical systems and photonic packaging.Background in ATE environments for package-level testing.Familiarity with statistical process control and high-volume manufacturing analytics.Experience in automated microelectronic or photonic assembly processes, including epoxy/solder die attach, wafer inspection, and underfill dispense.Knowledge of automotive qualification standards such as AEC-Q100.This is a high-impact opportunity to shape cutting-edge optoelectronic packaging technology and collaborate with world-class teams in a fast-paced environment. If you are driven to innovate and eager to take ownership of complex packaging challenges, we’d like to hear from you. #J-18808-Ljbffr

Created: 2025-09-26