Electro Mechanical Design Engineer

Title: ElectroMechanical Design Engineer Job ID : 20212-1 Location: Orlando, FL Contract: 12-month contract to hire Citizenship Requirement: US Citizenship required (Ability to Obtain Security Clearance) Shift : 4/10-1st Shift Job Description: ElectroMechanical Design Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions. You will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with Lockheed Martin's senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware. Your responsibilities will include: • Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets. • Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features. • Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes. • Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback. • Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports. • Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems. • Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance. • Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption. • Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts. Required Experience: CREO: 3-6 years Materials: 2+ years CCA experience: 3-6 years PCB board level design experience: 3+ years Thermal Analysis : 3+ years BOM and Windchill Release experience: 3-6 years Technical Drawing: 3-6 years experience Packaging experience : 3-6 years #ElectroMechanicalEngineering #ElectronicsPackaging #AdvancedPackaging #HeterogeneousIntegration #CREODesign #PCBDesign #CCADesign #ThermalEngineering #SemiconductorPackaging #AerospaceEngineering #DefenseTechnology #MechanicalDesign #ProductDevelopment #FailureAnalysis #WindchillPLM #EngineeringDesign #PrototypeDevelopment #HardwareEngineering #ReliabilityEngineering #NextGenElectronics

Created: 2026-03-04