Senior Engineer I, AS Field Applications

Job Description The person will be responsible for developing advanced interconnect technologies for semiconductor device packaging. This role encompasses 1) developing advanced packaging process solutions, usually in conjunction with our customers, 2) development and testing of advanced packaging assembly equipment and 3) maintain, repair and support advanced packaging assembly equipment. The candidate should have a strong background in engineering or science directly related to semiconductor packaging technologies. Strong aptitude in working with highly advanced mechatronic machinery is required. Strong analytical and communication skills are required. ResponsibilitiesWork closely with our customers to develop and optimize advanced packaging processes for semiconductor manufacturing Serve as the lead technical interface for customers, helping them develop and optimize their packaging recipes Troubleshoot and repair semiconductor packaging equipment, perform preventive maintenance (PM) on the machines when needed and train the customer engineers to use the equipment Communicate and align with the customer on a daily basis, prepare internal summary reports and customer presentations Escalate issues to the rest of the engineering team at other sites and work closely with them for resolutions Collaborate closely with the engineering team to support, maintain, and enhance machine performance, implementing feedback from field experiences Report identified issues and field observations to the engineering team, providing clear documentation to support continuous improvement efforts Test, troubleshoot and recommend improvements to advanced packaging assembly equipment Identifies, analyzes and resolves system design weaknesses This position requires extensive traveling to visit multiple US-based customers (up to 75%), The work is often performed in a cleanroom environment which requires wearing cleanroom suit QualificationsBachelors or Masters Degree (Masters preferred) in Mechanical or Electrical Engineering, Physics or other fields related to semiconductor packaging; 2+ years of experience in a related field; Knowledge of the semiconductor packaging is a plus; Hands-on, strong aptitude and deep understanding of highly advanced machinery; Experience with Advanced Packaging (flip chip, die attach or thermocompression bonding) highly preferred; Strong data analysis skills Ability to travel within the US, up to 75% of the time.

Created: 2026-03-04