SMT Principal Engineer

Job Summary The SMT Principal Engineer I at Jabil, Inc. is a senior technical contributor responsible for leading advanced surface mount technology (SMT) process development, optimization, and continuous improvement initiatives across multiple manufacturing lines to ensure high-quality and efficient production of complex electronic assemblies. Job ResponsibilitiesLead the development, implementation, and optimization of SMT processes, including paste printing, pick-and-place FUJI, reflow soldering, and post-reflow inspection (AOI, X-ray).Conduct in-depth analysis of SMT process data, identifying root causes of defects and implementing effective corrective and preventive actions.Develop and qualify new SMT equipment, materials, and processes, ensuring seamless integration into existing production environments.Provide expert technical guidance and mentorship to junior engineers and production teams on SMT best practices, troubleshooting, and process control.Collaborate with design engineering, supply chain, and quality departments to ensure manufacturability (DFM) of new products and resolve SMT-related design issues.Drive continuous improvement projects utilizing methodologies such as Six Sigma, Lean Manufacturing, and SPC to enhance SMT yield, throughput, and reliability.Author and maintain comprehensive SMT process documentation, including work instructions, process specifications, and failure analysis reports.Evaluate and implement new SMT technologies and industry trends to maintain Jabil's competitive edge and address evolving product requirements.Lead efforts in root cause analysis for complex SMT failures, implementing robust solutions to prevent recurrence.Represent Jabil in technical discussions with customers and suppliers regarding SMT process capabilities and new product introductions. Job QualificationsBachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field. Master's degree preferred.8-12 years of progressive experience in SMT process engineering within a high-volume electronics manufacturing environment.Strong Knowledge of FUJI Setup, Nexim and ValorDemonstrated expertise in SMT equipment operation, programming, and maintenance, including printers, pick-and-place machines (e.g., Fuji, Programming, etc.), reflow ovens, and inspection systems (AOI, SPI, X-ray).In-depth knowledge of various soldering technologies, solder paste chemistries, and component packaging.Proven track record of leading process improvement projects and achieving significant yield and cost reductions.Strong analytical and problem-solving skills with a data-driven approach to decision-making (e.g., SPC, DOE).Excellent communication, interpersonal, and presentation skills, with the ability to effectively collaborate with cross-functional teams and external stakeholders.Proficiency in statistical analysis software (e.g., Minitab, JMP) and CAD software for DFM analysis.Familiarity with industry standards such as IPC-A-610 and J-STD-001.Ability to work independently and manage multiple complex projects simultaneously.

Created: 2026-03-17