Power Electronics Packaging Engineer

Delta Electronics (Americas) Ltd. is seeking a power electronics engineer with expertise in power semiconductor module packaging to join our advanced Milan M. Jovanovi Power Electronics Lab, located in Research Triangle Park, NC. Through your motivation, creativity, and results-oriented attitude, you will help us to achieve our mission to provide innovative, clean and energy-efficient solutions for a better tomorrow.In this role, you will have opportunity to develop and verify your ideas to improve the performance of next generation power semiconductor modules in a variety of applications, including but not limited to on-board charging converters, EV traction inverters, charging stations, wind and solar inverters, and energy storage. You will have the opportunity to collaborate with other teams worldwide, interact with suppliers, attend conferences and publish your research work in technical venues.Power Electronics Packaging Engineer: Responsibilities Propose new concepts to enhance power semiconductor module electrical and thermal performances Design, build and verify selected new package concepts and technologies using state-of-the-art multi-physics simulation tools Research new approaches to improve the following aspects in the power modules: parasitic components, e-field distribution, insulation, partial discharge, thermal performance, die attach, interconnects, mechanical fatigue, etc Translate application requirements into power semiconductor module specifications Interact with chip makers and material suppliers Build and maintain technical competency in power electronics packaging technologiesSkills and ExperienceYou should demonstrate knowledge, understanding and experience with the following topics: Standard industry power module technologies New packaging technology trends, including but not limited to substrates, die attach, interconnects, encapsulation, insulation, direct cooling, etc Power electronics packaging materials and characteristics Power electronics concepts (topologies, building blocks, parasitic effects, EMI, losses, partial discharge, etc ) Power semiconductor devices (SiC MOSFETS, SiC diodes, Si IGBTs, etc) ANSYS simulation (Maxwell, Q3D, etc) CAD and CFD simulation tools (SolidWorks, Flotherm, etc ) Cost tradeoffs, mechanical tolerances, manufacturability, etc Manufacturing process for molding, soldering, wire bonding, sintering, encapsulation, etc Power module failure modes and reliabilityQualifications M.S. or Ph.D. degree in Electrical Engineering Junior and senior applicants welcome Candidates should possess excellent analytical, organizational, interpersonal, and communication skills. You must be self-motivated and able to work independently as well as a member of a team

Created: 2026-03-17