Scientist-Thermal Interface Materials

RESPONSIBILITIES:Develop and execute R&D strategies and technology roadmaps for next-generation electronic materials.Lead the development and scale-up of advanced adhesive technologies using DoE, modeling, and process optimization.Mentor junior scientists and foster a culture of technical excellence and continuous learning.Drive collaborative innovation with global customers, academic institutions, and external partners.Analyze complex technical challenges, identify root causes, and implement risk-mitigating solutions.Build and manage a strategic IP portfolio to secure competitive advantages.Represent the organization at international conferences and industry forums to enhance technical visibility.BACKGROUND PROFILE:PhD or equivalent expertise in Chemistry, Chemical Engineering, Polymer Science, or Materials Science.5+ years of industry experience in product development for electronic materials and adhesive technologies.Deep expertise in thermoset systems, high-reliability adhesives, and interface engineering for microelectronics.Strong communication and influence skills, with the ability to translate technical insights into strategic direction.Advanced proficiency in experimental design, statistical modeling, and high-throughput screening.Proven leadership in lab operations, safety culture, and mentoring of junior scientists.Demonstrated ability to lead multiple high-impact projects with strategic prioritization and cross-functional alignment.

Created: 2026-04-02