IC Package Integration Lead

Role Number: 200632600-3401 Summary Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description u2022 Work with cross-functional teams and lead package integration and architecture efforts.u2022 Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs.u2022 Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.u2022 People managerial skills highly desirableu2022 Travel u2013 5-10% Minimum Qualifications + BS and 10+ years of relevant industry experience. Preferred Qualifications + We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development, Managerial skills highly desired. + Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA. + Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints. + Background and Knowledge of Cellular/Connectivity/PMU packaging highly desirable. + Excellent problem solving with strong physics and fundamentals. + Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers. + Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost. + Ability to work independently and take on projects with minimum supervision. + Ability to lead and manage teams. Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant (.

Created: 2025-11-19