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PCB Fab DFM/SMT Engineer

MSCCN - Palo Alto, CA

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Job Description

Snap Inc ( is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate. Snap contributes to human progress by empowering people to express themselves, live in the moment, learn about the world, and have fun together. The Companyu2019s three core products are Snapchat (, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio (, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles (. The Spectacles team is pushing the boundaries of technology to bring people closer together in the real world. Our fifth-generation Spectacles, powered by Snap OS, showcase how standalone, see-through AR glasses make playing, learning, and working better together. Weu2019re looking for a PCB Fab/DFM/SMT Engineer to join our Spectacles team and support manufacturing, DFM, and assembly of our rigid boards and flexes. This role bridges hardware design, fabrication vendors, and SMT assembly operations to ensure high-quality, cost-effective, and manufacturable PCB products. The engineer ensures that PCB designs adhere to DFM/DFT/DFR guidelines, oversees SMT processes, troubleshoots manufacturing issues, and optimizes workflows for yield and reliability. What youu2019ll do: + Work with engineering, board designers, technical operations and contract manufacturers to ensure SMT and PCB fabrication design for manufacturability + Work w/ PCB fabrication suppliers to consolidate and negotiate PCB/flex design rules + Run DFM checks by automated tool and work with PCB designers, EE, and suppliers to resolve conflicts/issues. + Provide PCB/flex stack-up and material recommendations. + Provide guidance and review of PCBs/flexes to optimize yields, performance, and reliability + Provide subject matter expertise on PCB process and DFM requirements to Engineering and Operations + Plan, coordinate and analyze Design-of-Experiments to improve and extend manufacturing and fabrication capabilities + Plan, manage, and execute an PCB technology roadmap to drive product miniaturization + Support prototype builds with contract manufacturers in Asia (estimated travel 10-30%, primarily to Asia) + Drive continuous improvement in factory yield and throughput + Provide failure analysis and resolution for fabrication and SMT related defects Knowledge, Skills & Abilities: + Strong background in PCB and flex fabrication + Background and experience with SMT screen printing, placement, reflow and other SMT technologies. + Experience utilizing DFM tools to ensure proper PCBA and padstack designs + Familiar with analytic tools such x-ray, cross-sections, red-dye, etc. + Solid understanding of Six Sigma concepts + Demonstrated ability to design, execute and evaluate Design-of-Experiments + Able to prioritize duties and work independently + Excellent interpersonal skills with a high attention to detail Minimum Qualifications: + B.S. in Mechanical Engineering, Materials Science, chemistry, physics or equivalent + 7+ years of experience with PCB/PCBA in consumer electronics industry Preferred Qualifications: + Advanced degree in a related technical field + Experience working collaboratively with both internal and external partners, domestic and overseas + Six Sigma Black Belt certification + Strong understanding of PCB fabrication processes (stack-ups, laminates, plating, drilling, HDI, impedance control). + Experience with HDI, rigid-flex, flex, microvia structures, and high-speed designs. + Hands-on experience with SMT processes (reflow, stencil design, pick-and-place, AOI/X-ray). + Proficiency with ECAD/MCAD tools (Cadence Allegro, CAM350, Valor, & NX preferred). + Experience reviewing and generating DFM, DFA, DFT documentation. + Ability to interpret fabrication drawings, assembly files, stack-ups, and material specs. If you have a disability or special need that requires accommodation, please donu2019t be shy and provide us some information (.

Created: 2025-12-05

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