Senior / Principal TCAD Modeling Engineer

Job Description Insight Global is looking for a Senior / Principal TCAD Modeling Engineer that will be working on site in Austin, TX and support a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc. They are Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, they are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing. Responsibilities: u2022Develop and own TCAD modeling frameworks for advanced devices and interfaces relevant to 3DHI, including hybrid bonding contacts, TSVs, BEOL interconnects, and emerging device structures. u2022 Perform multi-physics simulations (electrical, thermal, mechanical, and reliability) to predict performance, variability, and failure mechanisms across stacked, heterogeneous die systems. u2022 Co-optimize device, interconnect, and packaging designs by working closely with process integration, packaging, and circuit teams to close the loop between fabrication, measurement, and simulation. u2022 Calibrate and validate TCAD models using silicon data from wafer-level test vehicles and process monitors; drive model-to-hardware correlation across corners and stress conditions. u2022 Define simulation methodologies and best practices for 3D device and interface modeling (e.g., contact resistance, current crowding, electromigration, thermo-mechanical stress). u2022 Engage with foundry, EDA, and materials partners to influence next-generation TCAD tool features and process design enablement for 3D-stacked systems. u2022 Author technical documentation, modeling guidelines, and reference flows to support ecosystem adoption of the device and interface platforms. We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy: Skills and Requirements u2022 Ph.D. or M.S. in Electrical Engineering, Materials Science, Applied Physics, or a closely related field with strong emphasis on device physics and numerical simulation. u2022 8+ years (Senior) or 12+ years (Principal) of hands-on experience with TCAD for semiconductor devices or interconnects. u2022 Deep understanding of semiconductor device physics (MOSFETs, diodes, contacts) and transport mechanisms relevant to nanoscale and 3D structures. u2022 Proficiency with commercial TCAD tools such as Synopsys Sentaurus, Silvaco Atlas/Victory, or equivalent multiphysics simulation environments. u2022 Experience correlating TCAD models with silicon data and extracting physical parameters from measurements. u2022 Strong background in process integration effects (doping, defects, interfaces, stress, and materials). u2022 Ability to work cross-functionally with process, packaging, EDA, and system teams in a fast-moving R&D environment u2022 Experience modeling 3D integration features such as hybrid bonding interfaces, TSVs, or wafer-to-wafer/die-towafer stacks. u2022 Familiarity with reliability physics (electromigration, TDDB, stress migration, thermal cycling) in advanced interconnects or contacts. u2022 Exposure to advanced materials systems (Cu-Cu bonding, barrier/liner stacks, low-k dielectrics, compound semiconductors). u2022 Knowledge of compact model extraction and linkage between TCAD and SPICE-level models. u2022 Publication or patent record in semiconductor device modeling, interconnect physics, or advanced packaging. u2022 Strong technical writing and presentation skills for industry and defense-sector collaborations.

Created: 2026-02-04