Integrated Circuit Design Engineer

Job Title: Integrated Circuit Design Engineer Job Description We are seeking an experienced package design engineer to work on complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a global R&D team developing high-performance package designs for ASICs, supporting artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include advanced features such as 224G SerDes, 5G RF/Microwave ADC/DAC, HBM, DDR5, and more. This role offers the opportunity to collaborate with a team to create innovative package structures and contribute to efficiency improvements within our design team. Responsibilities + Design complex flip-chip-BGA packages for ASICs with high-speed SerDes and high-power delivery requirements. + Collaborate with a worldwide R&D team on high-performance package designs for AI, networking, HPC, and 5G base stations. + Determine necessary package types by analyzing chip requirements. + Handle pin assignments and layout critical structures for SerDes, ADC/DAC, DDR, etc. + Apply knowledge of signal integrity and power integrity to package designs. + Cooperate with internal team members and external vendors across multiple time zones. + Manage self-directed projects and organize tasks effectively. + Engage in project management responsibilities during the initial phase, including requirement gathering and problem-solving for engineering issues. Essential Skills + 8+ years of experience in flip-chip-BGA package design with high-speed SerDes (BSEE or similar field) OR 6+ years of experience with MSEE or similar field. + Experience with Cadence APD (Allegro Package Designer) or equivalent tools. + Background in semiconductor packaging, signal integrity, power integrity, and chip design. + Strong self-management and organizational skills. Additional Skills & Qualifications + Project management experience is a strong plus, especially in taking projects end-to-end as a package architect/engineer. + Experience with design automation and coding. + Experience in problem-solving related to engineering issues like warpage and power integrity. Work Environment This position is 100% remote. Job Type & Location This is a Contract position based out of Fort Collins, CO. Pay and Benefits The pay range for this position is $60.00 - $100.00/hr. Eligibility requirements apply to some benefits and may depend on your job classification and length of employment. Benefits are subject to change and may be subject to specific elections, plan, or program terms. If eligible, the benefits available for this temporary role may include the following: u2022 Medical, dental & vision u2022 Critical Illness, Accident, and Hospital u2022 401(k) Retirement Plan u2013 Pre-tax and Roth post-tax contributions available u2022 Life Insurance (Voluntary Life & AD&D for the employee and dependents) u2022 Short and long-term disability u2022 Health Spending Account (HSA) u2022 Transportation benefits u2022 Employee Assistance Program u2022 Time Off/Leave (PTO, Vacation or Sick Leave) Workplace Type This is a fully remote position. Application Deadline This position is anticipated to close on Mar 12, 2026. About Actalent Actalent is a global leader in engineering and sciences services and talent solutions. We help visionary companies advance their engineering and science initiatives through access to specialized experts who drive scale, innovation and speed to market. With a network of almost 30,000 consultants and more than 4,500 clients across the U.S., Canada, Asia and Europe, Actalent serves many of the Fortune 500. The company is an equal opportunity employer and will consider all applications without regard to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law. If you would like to request a reasonable accommodation, such as the modification or adjustment of the job application process or interviewing due to a disability, please email ( ) for other accommodation options.

Created: 2026-03-02