Senior RF Engineer

About Get immediate hands-on experience working with the brightest minds to solve complex problems that matter from autonomous vehicles, drones, and factories, to augmented reality, and remote healthcare. Enjoy a culture that values aligned goals, work-life balance, continuous learning throughout your career and shared rewards. At ADI, we invest in you and succeed together because we believe that happy, healthy, intellectually challenged people drive our growth and market leadership.ADEFADI’s Aerospace and Defense (ADEF) business is focused on three (3) key areas of technology: Data-Converters, Radio Frequency (RF), and Micro-ElectroMechanical Systems (MEMS). Our diverse engineering community is a recognized leader providing forward thinking designs that meets tomorrow’s needs, today, at scale. Whether discreet components or sub-systems, ADEF is disrupting the defense industry providing the ability to redefine and deter conflict on land, sea, and air. Space is being redefined in ways only previously imagined. The aerospace industry’s resurgence brings the physical world closer than ever before with smarter, faster, more interactive access with innovative technology such as eVTOL and autonomy that will change the way we travel and move commerce. Be part of the excitement, bringing your ideas to reality in an environment where you’re encouraged and challenged to reach your full potential. Together - Let’s stay ahead of what’s possible.The Advanced Data Converter group is seeking an intelligent and versatile RF designer to join the RFIC and IC/package co-design team, enabling state-of-the-art performance for the world’s highest performing RF data converters.Specific Responsibilities / Duties may include:Design, analysis and model extraction of RF multi-chip packages for high-performance, mixed-signal product line with RF inputs up to 40 GHz.Designs include complex power delivery networks for data transceivers operating up to 48Gsps with multiple isolated power domainsRF probe measurements for performance verificationDesign, analysis and model extraction for on-chip components such as filters, balun, transmission lines and matching networksConsult and contribute to package technology development with industrial and government partners for next-generation chiplet-based products.Previous Experience/Skills Needed & Education Requirements:MS with 3yr or PhD degree in EE or ECE or equivalentStrong background in electromagnetic static and dynamic conceptsFamiliarity with High-speed Analog and RF circuit signal and power integrity requirementsStrong analytical and problem-solving skillsStrong team worker with multi-discipline and multi-cultural environmentsCapable of clear, accurate and timely communication both written and verbalExperience with RF EDA tools such as: Cadence Allegro, Cadence Clarity, Ansys 3D Layout, Ansys HFSS, ADS RFPro and MomentumPreferred:High-speed Analog and RF circuit familiarity, with emphasis on electromagnetic conceptsFamiliarity of manufacturing processes for advanced flip-chip and fanout package technologies#LI-PG1Job Req Type: ExperiencedRequired Travel: NoShift Type: 1st Shift/Days

Created: 2026-03-04