New College Grad - Wafer Bonding Process Development ...

New College Grad - Wafer Bonding Process Development Engineer at Micron Technology, Inc. in Boise, Idaho, United States Job Description Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Process Development Engineer to work within the wafer bonding process team at Micron Technology, Inc. Micron Technology Inc. is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions starting with foundational DRAM, NAND, and NOR Flash memory, and extending to SSDs, MCPs, HBM and other memory-based systems. As the only memory manufacturer in the western hemisphere, Micron has been in the industry for over forty-five years and continues to be the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted thus far. As a Wafer Bonding Process Development Engineer, you will be part of a revolutionary 3D DRAM Technology Development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration and other process areas including Dry Etch, Wet process, Metals, CVD, Diffusion, Lithography and CMP. You will work on state-of-the-art equipment and own the process roadmap to meet the program and yield goals. Job Responsibilities : + Developing wafer bonding process to meet the physical & electrical requirements of Micron’s products. + Optimizing wafer bonding processes to reduce cost, process variability, and improve process capability. + Collaborating with process integration and other process development teams to develop innovative new solutions. + Conducting root cause and failure mode analysis to understand the limitations of current hardware and driving vendors for solutions. + Performing fundamental research to drive innovative solutions for next-generation products. + Maintaining a technology development pilot manufacturing line. + Support process transfer to production facilities (some domestic and/or international travel may be required). Minimum Qualifications: + Education: MS preferred, or BS plus relevant semiconductor experience (required). Majors should include Chemical Engineering, Materials Science, To view full details and how to apply, please login or create a Job Seeker account

Created: 2026-03-20