Integrated Circuit Design Engineer

Candidates can sit out of San Jose, CA or Austin, TX Full-time opportunity Client willing to pay relocation assistance if needed Job Title: Integrated Circuit Design Engineer Job Description Seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. Join a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5, and more. Collaborate to create the package structures needed to enable new design and contribute to efficiency improvements. Responsibilities + Design complex flip-chip-BGA packages for ASICs. + Collaborate with a global R&D team to develop high-performance package designs. + Determine necessary package structures for different chip designs. + Assign pins and layout critical structures for SerDes, ADC/DAC, and DDR. + Cooperate with internal team members and external designers across multiple time zones. + Manage and organize project timelines and tasks effectively. + Gather requirements and communicate with chip team partners. + Route and develop structures while addressing signal integrity and power integrity concerns. + Problem-solve engineering issues such as warpage and power integrity. + Select appropriate package layers and manage the entire pin assignment process. Essential Skills + 8+ years' experience in flip-chip-BGA package design with a BSEE or 6+ years with an MSEE. + Experience with high-speed SerDes. + Knowledge of package-level signal integrity and power integrity. + Proficiency in Cadence APD (Allegro Package Designer) or equivalent tools. + Strong self-management and organizational skills. Additional Skills & Qualifications + Project management experience is a strong advantage. + Experience in EE (semiconductor/packaging). + Design automation and chip design experience. + Problem-solving skills in complex IT environments. Work Environment Work 5 days a week onsite in Fort Collins, CO, or hybrid options available in San Jose, CA, and Austin, TX. Enjoy a large campus environment with an amazing food hall focused on employee wellness. Competitive pay, great benefits, and a bonus structure are provided. Job Type & Location This is a Contract position based out of Fort Collins, CO. Pay and Benefits The pay range for this position is $60.00 - $100.00/hr. Eligibility requirements apply to some benefits and may depend on your job classification and length of employment. Benefits are subject to change and may be subject to specific elections, plan, or program terms. If eligible, the benefits available for this temporary role may include the following: u2022 Medical, dental & vision u2022 Critical Illness, Accident, and Hospital u2022 401(k) Retirement Plan u2013 Pre-tax and Roth post-tax contributions available u2022 Life Insurance (Voluntary Life & AD&D for the employee and dependents) u2022 Short and long-term disability u2022 Health Spending Account (HSA) u2022 Transportation benefits u2022 Employee Assistance Program u2022 Time Off/Leave (PTO, Vacation or Sick Leave) Workplace Type This is a fully remote position. Application Deadline This position is anticipated to close on Apr 10, 2026. Diversity, Equity & Inclusion At Actalent, diversity and inclusion are a bridge towards the equity and success of our people. DE&I is embedded into our culture through: + Hiring diverse talent + Maintaining an inclusive environment through persistent self-reflection + Building a culture of care, engagement, and recognition with clear outcomes + Ensuring growth opportunities for our people Actalent is an equal opportunity employer. About Actalent Actalent is a global leader in engineering and sciences services. For more than 40 years, weu2019ve helped visionary companies advance their goals. Headquartered in the United States, our teams span 150 offices across North America, EMEA, and APACu2014with four delivery centers in India led by 1,000+ extraordinary employees who connect their passion with purpose every day. Our Bangalore, Hyderabad, Pune, and Chennai delivery centers are hubs of engineering expertise, with core capabilities in mechanical and electrical engineering, systems and software, and manufacturing engineering. Our teams deliver work across multiple industries including transportation, consumer and industrial products, and life sciences. We serve more than 4,500 clients, including many Fortune 500 brands. Learn more about how we can work together at .

Created: 2026-03-30