ASIC II - AMZ25487.3

DescriptionEmployer: Annapurna Labs (U.S.) Inc. Position: ASIC II AMZ25487.3 Location: Austin, TX Multiple Positions Available: 1. Develop detailed CFD and compact RC models for SoC and Package thermal analysis 2. Knowledge of hardware and software based thermal / power management control algorithms 3. Optimize air and liquid cooled thermal solutions under PPA and system design constraints 4. Simulate and prototype thermal control strategies 5. Validate thermal models through power/thermal measurements on Hardware 6. Responsible for the design and optimization of hardware for largescale data center deployment including rack level integration, liquidcooling facility integration and serviceability 7. Identify, design, test and integrate new thermal-mechanical technologies for large-scale server deployments to deliver a world class customer experience. 8. Own thermal-mechanical design from the lowest levels of chip SOC design to rack assembly and see those systems all the way through to high volume manufacturing. 9. Domestic or international travel up to 25% to perform role responsibilities may be required (40 hours / week, 8:00am-5:00pm, Salary Range $141586 - $184000) is an Equal Opportunity u2013 Affirmative Action Employer u2013 Minority / Female / Disability / Veteran / Gender Identity / Sexual Orientation Basic QualificationsMasteru2019s degree or foreign equivalent degree in Mechanical Engineering, Thermal Engineering, or a related discipline and 3 years of experience in the job offered or a related occupation in mechanical engineering, thermal engineering or related. In the alternative, employer will accept a Bacheloru2019s degree or foreign equivalent degree in Mechanical Engineering, Thermal Engineering, or a related discipline followed by 5 years of progressively responsible post-baccalaureate experience in the job offered or a related occupation in mechanical engineering, thermal engineering or related. Experience must include: 1) 3 years of experience in Mechanical and Thermal design of both air and liquid cooled electronic Systems 2) 3 years of experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems 3) 3 years of experience with SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques 4) 3 years of experience with programming languages: Python, C++, and working in Linux environment . Preferred QualificationsAll applicants must meet all the above listed requirements. Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status. Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit for more information. If the country/region youu2019re applying in isnu2019t listed, please contact your Recruiting Partner.

Created: 2026-04-04