ASIC II - AMZ25487.3

Employer: Annapurna Labs (U.S.) Inc.Position: ASIC II AMZ25487.3Location: Austin, TXMultiple Positions Available:1. Develop detailed CFD and compact RC models for SoC and Packagethermal analysis2. Knowledge of hardware and software based thermal / powermanagement control algorithms3. Optimize air and liquid cooled thermal solutions under PPA andsystem design constraints4. Simulate and prototype thermal control strategies5. Validate thermal models through power/thermal measurements onHardware6. Responsible for the design and optimization of hardware for largescale data center deployment including rack level integration, liquidcooling facility integration and serviceability7. Identify, design, test and integrate new thermal-mechanicaltechnologies for large-scale server deployments to deliver a worldclass customer experience.8. Own thermal-mechanical design from the lowest levels of chip SOCdesign to rack assembly and see those systems all the way throughto high volume manufacturing.9. Domestic or international travel up to 25% to perform roleresponsibilities may be required(40 hours / week, 8:00am-5:00pm, Salary Range $141586 - $184000) is an Equal Opportunity - Affirmative Action Employer - Minority / Female / Disability / Veteran / Gender Identity / Sexual OrientationBASIC QUALIFICATIONSMaster’s degree or foreign equivalent degree in Mechanical Engineering, Thermal Engineering, or a related discipline and 3 years of experience in the job offered or a related occupation in mechanical engineering, thermal engineering or related. In the alternative, employer will accept a Bachelor’s degree or foreign equivalent degree in Mechanical Engineering, Thermal Engineering, or a related discipline followed by 5 years of progressively responsible post-baccalaureate experience in the job offered or a related occupation in mechanical engineering, thermal engineering or related. Experience must include: 1) 3 years of experience in Mechanical and Thermal design of both air and liquid cooled electronic Systems 2) 3 years of experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems 3) 3 years of experience with SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques 4) 3 years of experience with programming languages: Python, C++, and working in Linux environment .PREFERRED QUALIFICATIONSAll applicants must meet all the above listed requirements.Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.Our inclusive culture empowers Amazonians to deliver the best results for our customers.

Created: 2026-04-17